To strengthen edge AI capabilities, what is the magic of Lattice's new CertusPro-NX general-purpose FPGA?

Lattice has launched a series of FPGA products based on Samsung’s 28nm FD-SOI platform, including CrossLink-NX, which is widely used in the embedded video, the redefined Certus-NX, the security-based FPGA Mach-NX that came out in Q4 last year, and t

A smart meter that earns at least 30 billion a year and makes a fortune

From a business perspective, what kind of market is most worth investing in? Some people may think that it is a market with explosive growth, such as the virtual currency market, but it is extremely risky, and there is no physical object but a concept; or

Both Samsung and SK Hynix have achieved it. The pressure of EUV DRAM has come to Micron?

Recently, SK Hynix's official website released news that the company had begun mass production of 8Gb LPDDR4 mobile DRAM products using the fourth-generation 10nm (1a) process in early July. It is worth noting that this is the first time that SK Hynix

Samsung announces that its first integrated automotive-grade ISOCELL image sensor has been put into mass production

Seoul July 13, 2021, Samsung launched the ISOCELL Auto 4AC, which is an automotive-grade image sensor that provides 120 decibels (decibel, dB) high-dynamic-range images (High-Dynamic Range, HDR) and supports light-emitting diodes (LED) Flicker suppression

Now that EUV production is in place, should the yield also be considered?

When the current semiconductor manufacturing process continues to develop below 7nm, the EUV lithography machine has become one of the indispensable tools for IDM and foundries. As TSMC, Samsung, Intel, SK Hynix, and other companies have EUV lithography m

Xinmao Micro completes tens of millions of C rounds of financing and enters Nubia's fast charging supply chain

Recently, Xinmao Microelectronics completed a series C financing of tens of millions of yuan, led by Guoxin Capital. According to reports, after the completion of the financing, Xinmao Micro will lay a solid foundation and prepare for the next impact of t

From smart factory to transparent factory, how should industrial robot companies evolve

In recent years, the development momentum of my country's robotics industry has been good. Many outstanding companies have emerged and many outstanding products have been launched, such as industrial robots, collaborative robots, medical robots, agric

Unigroup Youshang Group launched a 15KW three-phase two-way charging pile power supply solution based on ST products

On July 20, 2021, the leading distributor of semiconductor components dedicated to the Asia-Pacific market, Grand United Holdings, announced that its subsidiary Youshang has launched a 15KW three-phase two-way charging pile power solution based on STMicro

Foxconn adopts Google machine learning to produce automatic detection systems for production line

According to CNA's report today, Foxconn used Google's machine learning program as the basis to produce an automatic detection system for the production line, which greatly reduced the defect rate of smartphone parts and significantly reduced the

TWK launches ultra-small safety encoder-TRK38

TWK has launched an ultra-compact single-turn magnetic encoder specially designed for safety applications-TRK38, with a diameter and length of only 38 mm, suitable for installation in narrow installation spaces. It has a high safety level: this safety enc

Biochip

Biochip technologyBiochip refers to the orderly solidification of a large number of biological macromolecules on the surface of the support according to the methods of Hiroshima in-situ synthesis or micro-spotting, forming a dense two-dimensional molecula

Watchdog chip Watchdog working principle

In the microcomputer, because the single-chip microcomputer is often interfered with by the external electromagnetic field, the register and memory data are confused, which causes the program pointer error to fall into an infinite loop, and the microcompu

FPGA's main application areas and industry chain composition

AI chips are mainly divided into CPU, GPU, FPGA, and ASIC. Among them, in the order of CPU, GPU, FPGA, and ASIC, the versatility is gradually reduced, but the computing efficiency is gradually improved.FPGA is a product of further development on the basis

What is the complete chip packaging process?

Chips are a very high-tech and professional field, and the entire production process is particularly complicated. Commodities on the market generally go through three stages from scratch, design, manufacture, and packaging. The chip industry is no excepti

In the first half of the year, production and sales increased nearly 2 times year-on-year! China's hot sales of electric vehicles cause battery shortage, CEO goes to battle to grab production capacity

On July 8, the Passenger Association released the national passenger car production and sales data for June 2021. In June, the wholesale sales of new energy passenger vehicles reached 227,000, an increase of 14.7% month-on-month, and the retail sales of n

Weir Shares Announces Pre-Increase Announcement for 2021 Semi-annual Results

On July 1st news, Shanghai Weir Semiconductor Co., Ltd. (hereinafter referred to as "Weir Shares") announced an announcement of pre-increased performance for the first half of 2021.According to the announcement, Weil shares expects to achieve a net profit

Renesas Electronics launches new 700V step-down regulator product family

Suitable for applications such as home appliances, smart homes, sensing systems, electricity meters, and industrial controlThe new product has extremely low power consumption, excellent EMI performance, and no audio noise, which can reduce BOM costs and b

Huawei discloses "semiconductor device" related patents

Recently, according to Tianyancha, Huawei Technologies Co., Ltd. has published a patent for "Semiconductor Devices and Related Modules, Circuits, and Manufacturing Methods", with publication number CN113054010A, and the application date is February 2021.T

Next-generation semiconductor competition: superconductor contacts are expected to achieve 1nm chips

It has always been the dream of scientists to make chips thinner and thinner.But we all know that the existing silicon crystals are getting closer and closer to the physical limit.To make a breakthrough from "nano-level" to "atomic level", we can only rel

Dirac and ADI join forces to provide scalable, high-quality audio to the automotive industry

Uppsala, Sweden, June 8, 2021 - Dirac, the pioneer of Swedish digital audio, announced today that it will cooperate with the leading American semiconductor company Analog Devices, Inc. (ADI) cooperated to combine Dirac's new digital solutions for entr

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